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Global Thermal Interface Materials Market Research Report

  • Report Code: IN 1019
  • Publish Date: Upcoming
  
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Global Thermal Interface Material Market, By Technology (Pressure- Sensitive Adhesive Tapes, Thermal Adhesive, Thermal Greases, Thermal Gels, Pastes and Liquids, Elastomers Pads, Phase Change Materials, Graphite, Solders And Phase Change Metals, Compressible Interface Materials, and Others) & Geography- Forecast till 2019

 

Thermal Interface Materials (TIM) are thermally conductive materials which contain thermal assemblies and thermoelectric modules for applications such as instrumentation, telecom, etc. TIM conforms and softens at variable temperature which leads to heat removal instantaneously; thus, offers reliable operations. There are various TIM technologies such as liquid metals, thermal greases, thermal adhesives, graphite, compressible interface materials, phase change materials, elastomeric pads, thermal gels, pastes & liquids, pressure sensitive adhesive tapes and others. furthermore, these Tim technologies has widespread industrial applications such as medical electronics, defense & aerospace electronics, automotive electronics, photovoltaics, LED lighting, wireless sensor networks, consumer & mobile handheld electronics, and others.

 

TIM provides low thermal resistance and it fulfills standard quality guidelines of providing highest system reliability and longest durability. Moreover, due to its thermal performance, TIM market witnesses strong demand from industries such as electronics, electrical, and others. Better properties of TIM drive its demand across various industries. Also, as per the requirement, various technologies are provided by TIM which furthermore drives its demand in its application areas. Moreover, the report covers technologies such as pressure- sensitive adhesive tapes, thermal adhesive, thermal greases, thermal gels, pastes and liquids, elastomers pads, phase change materials, graphite, solders and phase change metals, compressible interface materials, and others. The TIM market is projected to grow at a CAGR of XX.X% during 2014-2019.

 

Competitive scenarios of the top players in the TIM market have been discussed in detail. Leading players of this industry with their recent developments and other strategic industry activities are also covered in the report. Companies, such as 3M Electronic Materials, Ai Technology, Indium Corporation, European Thermodynamics Ltd, Momentive, Henkel, Kitagawa Industries, Parker Chomerics,      Ellsworth Adhesives, Dymax Corporation, and other are operating in the market.



1 Introduction
1.1 Objectives Of The Study
1.2 Market Segmentation & Coverage
1.3 Stakeholders
2 Research Methodology
2.1 Integrated Ecosystem Of Thermal Interface Materials Market
2.2 Arriving At The Thermal Interface Materials Market Size
2.2.1 Top-Down Approach
2.2.2 Bottom-Up Approach
2.2.3 Demand Side Approach
2.2.4 Macro Indicator-Based Approach
3 Market Overview
3.1 Introduction
3.2 Thermal Interface Materials Market: Comparison With Parent Market
3.3 Market Drivers And Inhibitors
3.4 Key Market Dynamics
3.5 Demand Side Analysis
3.6 Vendor Side Analysis
4 Competitive Landscape
4.1 Thermal Interface Materials Market: Company Share Analysis
4.2 Company Presence In Thermal Interface Materials Market, By Type
5 Thermal Interface Materials Market, By Company
6 APPENDIX

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Global Thermal Interface Materials Market Research Report

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